Content
Product Features
CEPGC-31 copper clad laminate is a laminate made of epoxy resin as the matrix material, alkali-free glass fiber cloth treated with coupling agent as the reinforcing material, one or both sides of which are clad with copper foil, and hot pressed. This product is the CEPGC-31 board according to the national standard, which corresponds to the THAB-67 board of the original Ministry of Machinery Industry, the United States NEMA G-10 board, and the International Electrotechnical Commission IEC NO.4 board. The product substrate has excellent transparency and excellent machining properties such as punching, shearing and drilling. The product has been tested by SGS and meets the requirements of the EU RoHs environmental protection directive.
Product Usage
CEPGC-31 copper clad epoxy glass fiber cloth laminate is suitable for radio, electrical meters, electronic equipment, computers and other electrical equipment as printed circuit boards and multilayer printed circuit boards.
Product specifications and physical properties
1. Nominal thickness and tolerance: 0.6, 0.8 ± 0.14mm; 1.0, 1.2 ± 0.17mm; 1.5, 1.6 ± 0.20mm; 2.0, 2.5 ± 0.23mm; 3.0, 4.0, 5.0 ± 0.30mm.
2. Nominal area: 1000±020mm×1000±020mm.
3. Main technical indicators (implement GB4725-1992):
|
Numbering |
Item |
testing method |
unit |
index |
Test Results |
|
1 |
After peeling strength (thermal shock 260℃, 20s) |
GB/4722-92 |
N/mm |
≥1.4 |
1.6 |
|
2 |
RS after recovery of constant humidity and heat treatment |
MΩ |
≥5.0×104 |
5.52×104 |
|
|
3 |
Rv after constant heat treatment recovery |
MΩ.m |
≥1.0×104 |
1.57×104 |
|
|
4 |
Tgδ after restoration of constant humidity and heat treatment |
_ |
≤0.035 |
0.028 |
|
|
5 |
After recovery from constant humidity and heat treatment ε |
_ |
≤5.5 |
5.2 |
|
|
6 |
Vertical layer bending strength (longitudinal) |
MPa |
≥300 |
325 |
|
|
7 |
Thermal shock blistering: >288℃/10s |
|
No delamination, no blistering |
No delamination, no blistering |
Sales Manager: Chang Qing 13881068449
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